With the development ♥≤♦of miniaturization of electronic equipment, the s↔¥'αpace left for module power s₽←upply is usually very limited, and even some sβ ystems are closed. Therefore, heat dissipation be→✘comes the first issue★∞ to be considered. Improving€λ power efficiency and reducing heat loss are✘<β☆ related to the stable operation o'✔→↑f the power module and the reliable operat↑ ion of the entire system.
In the fields of railway♦∏→, medical treatment, milita÷☆ ry industry, etc., the≠₽< demand is increasing, becau≤±₩✔se it involves public transportation, personal sa✘¶©αfety and other issues, the first consideration is↕> the high reliability of th÷™♣e module, work safety and other requirement™↑s. The power module must be able to w♦ork normally for a long time under severe₩ → vibration or harsh environment, δ πand no errors are allowed. This is a challenge t↕©o the technical development and ∞÷€production process of domesσ'tic power module man"≈ufacturers, and both development and pλφ↑roduction lines must be very reliable.
Sequencing and tracking of power≈α supplies, designers have traditio↔ nally built separate ≤♣on-board circuits to handle voltage sequ←'©☆encing, using many components and taking u★∏p a lot of space. Now some pow∞♥Ω£er supply manufacturers have int$ ☆egrated this technology in chips or modules to "©↓<make it easier for system designers to comple≤≤¥λte the design.
With the continuous advancement of semiconduβγα ctor process technology, the★€ chips and components on the PCB boarα€☆↓d have higher functions, faster runniδ&ng speeds, and smaller volumes, driving poλ<&wer management ICs to provide lower and m™"ore accurate voltages, larger currents, and sδ¶"tricter requirements. Voltage feedbac →♦♦k accuracy, higher efficiency performanc≈÷e. On the other hand, the apα☆™♣plication field of power manaλ<☆gement ICs continues to expand and deepen, achievγ±≠♦ing better control func≠&"≥tions, smarter control loops♠€∏, faster dynamic response characteristics, ©✔and simpler peripheral layouβ€>t design. Therefore, simplifyin®≥g the design, digitization, modularization, and i™™∏&ntelligent power IC is an inevitabl≈&e development trend.
